행사가 개최되었습니다.
세부프로그램
| Time | Topic | Chair/Speaker |
|---|---|---|
| 09:00-09:20 | Registeration | |
| 09:20-09:30 | Opening | Young-Hyun Jun, President (The Semiconductor Society, IEIE) |
| Session-1 : Trends and Market Session Chair : Dr. Seung Wook Yoon (Statschippac) |
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| 09:30-10:10 | Trends in Wafer Level Packaging | Santosh Kumar (Director of 3D-IC, Yole) |
| 10:10-10:50 | Wafer Level Packaging, Driving 3D Hetergeneous System Integration From 3D-System-in-Package to 3D-System-on-Chip | Soon-Wook Kim (IMEC) |
| 10:50-11:10 | Coffee Break | |
| 11:10-11:50 | Fanout Packaging Technology as Device Integration Solution | Jong-Heon Kim (VP of Development, Nepes) |
| 11:50-12:30 | High Density Fanout Wafer Level Technology | Jin Young Khim (VP of R&D, Amkor Technology) |
| 12:30-14:00 | Lunch & Social | |
| Session-2 : Technology Development Session Chair : Dr. Tae-Je Cho (Samsung Semiconductor) |
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| 14:00-14:30 | Market Demand and Lithography Solutions | Alex Chow (VP of Product Marketing, Ultra Tech) |
| 14:30-15:00 | Thinning and Singulation Technology for Advanced Packaging | Youngsuk Kim (DISCO) |
| 15:00-15:20 | Coffee Break | |
| 15:20-15:50 | Development of Novel Low-Temperature Curable Positive-Tone Photosensitive Dielectric Materials with High Elongation | Ryoji Okuda (Principal Engineer of R&D, Toray) |
| 15:50-16:20 | Trends in Encapstulation Materials for WLP | Takeshi Mori (Head of R&D, Sumitomo Bakelite) |
| 16:20-17:00 | Wafer Level Packaging Development | Seung Wook Yoon (Director of Product and Technology Marketing, Statschippac) |
| 17:00-17:10 | Closing | Prof. Joong-Whee Cho, V.President (The Semiconductor Society, IEIE) |